Introduction to Semiconductor Packaging

О курсе

This course will cover various aspects of microelectronics and nanoelectronics. This field aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. The course will introduce you to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. The course will also look at historical observations and trends using Moore’s Law, which currently guides and predict development of the Semiconductor industry. Most importantly, our goal is to highlight why packaging is so important and relevant today. Furthermore, we will also explore the anatomy and function of a semiconductor package, starting with substrate-level package interconnection to the motherboard. We will also describe features as we differentiate various types of packages and how they differ in materials, design, and reliability.

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